TSMC’s chip research and development is ahead, semiconductor process chip etching plays an important role

According to Taiwanese media, unlike 3nm and 5nm, which use FinFET (FinFET) architecture, TSMC has adopted a brand-new multi-bridge channel field effect transistor (MBCFET) architecture at 2nm, and the development progress is ahead of schedule. According to TSMC’s overall advanced process layout in recent years, the industry estimates that TSMC’s 2nm will be launched in the second half of 2023, which will help it continue to win large orders for advanced processes from major manufacturers such as Apple and Huida and spur Samsung.

For decades, there has been a golden rule behind the progress of the semiconductor industry, namely Moore’s Law. Moore’s Law states: Every 18 to 24 months, the number of components that can be accommodated on an integrated circuit will double, and the performance of the chip will also double.

However, today when Moore’s Law slows down or even fails, several major semiconductor companies in the world are still fighting desperately, hoping to take the lead in taking the commanding heights of the manufacturing process layout.

TSMC’s 5nm has been mass-produced, 3nm is expected to be mass-produced in 2022, and the 2nm research discovery has made a major breakthrough!

From this matter, everyone will definitely contact the current Huawei. Facts have proved that you must have your own core skills so that you will not get stuck everywhere, and you can continue to develop and progress to create better value.

As the saying goes, if you want to run fast, you must first walk the road steadily. In other words, the foundation must be well laid. If the foundation of a high-rise building is not solid, I am afraid that the level 5 wind will collapse. As the most basic etching industry for circuit boards and semiconductors, this is especially true.

Here is a brief introduction to you what is etching:

Etching is a very important step in semiconductor manufacturing process, microelectronic IC manufacturing process, and micro-nano manufacturing process. It is a main process of pattern processing associated with photolithography.

Etching is a technique that uses chemical reaction or physical impact to remove materials. Etching techniques can be divided into two types: wet etching and dry etching.

It was first used to manufacture copper plate, zinc plate and other printing embossing plates, and also widely used in the processing of weight reduction instrument panels, nameplates and thin workpieces that are difficult to process by traditional processing methods; after continuous improvement and process equipment Development can also be used for the processing of precision etching products for Electronic thin parts in the aviation, machinery, and chemical industries. Especially in the semiconductor manufacturing process, etching is an indispensable technology.

From the technological process, it is divided into two types:

1. Dry etching: Use plasma to remove unnecessary materials (the most important method for etching devices under sub-micron size).

2. Wet etching: Use corrosive liquid to remove unnecessary materials.

In comparison, wet etching is widely used in the production process of related industries, and it can be seen everywhere in our daily life. For example: metal prints, indicator signs, decorative panels in elevator cars, etc., wet etching Two methods are mainly used in the processing process:

1. Exposure method: The project prepares the size of the material according to the graphics-material preparation-material cleaning-drying → filming or coating → drying → exposure → developing → drying-etching → stripping → OK

2. Screen printing method: cutting → cleaning plate (stainless steel and other metal materials) → screen printing → etching → stripping → OK

The processes of the above two processes have the problems of complex process, time-consuming and laborious in the production process, and the environmental pollution caused by the processing process seriously restricts the development of the industry, and emphasizes energy saving and emission reduction. Today, how to achieve environmental protection and improve production efficiency has become the goal pursued by every etching industry.

The success of the research and development of the etching excellent version processing technology is exactly what the market needs, and the purpose is to solve the problems mentioned above.

From then on, the process has changed from complicated to simpler. By printing, the anti-etching ink is directly printed on the plate, which is heat-set after printing. After the printing is completed, it is immediately etched. This technology provides more optimized solutions for digital production.

Compared with the above process, the etching process of the superior version can complete the pre-etching work in only three steps:

The graphics and text are finalized, the etching mask is printed, and the printing is completed, and it is etched immediately. The wide application of the etching excellent version will surely promote the rapid development of the domestic etching industry.

The Links:   G156HAB010 LQ231U1LW01

Related Posts