To reduce aircraft emissions, developers are increasingly moving towards more efficient designs, using electrical systems to replace the current pneumatic and hydraulic systems that power onboard alternators, actuators and auxiliary power units (APUs). To enable the next generation of aircraft electrical systems, new power conversion technologies are required. Microchip Technology Inc. today announced that it has developed the first aviation-compliant pedestal-less power module with the European Commission (EC) and the industry’s Clean Sky Alliance, aiming to achieve higher efficiency and Lightweight, more compact power conversion and motor drive systems.
Microchip’s BL1, BL2, and BL3 series of pedestalless power modules, developed in partnership with the Clean Sky Alliance, improve AC-DC and DC-AC power conversion and power generation efficiency by integrating silicon carbide power semiconductor technology, supporting stringent EU emission standards, Achieving a climate neutral aviation industry target by 2050. Thanks to an improved substrate, this innovative design is 40% lighter than other similar products and costs 10% less than standard power modules with metal backplanes. Microchip’s BL1, BL2 and BL3 devices meet all mechanical and environmental compliance requirements specified in RTCA DO-160G, Environmental Conditions and Test Procedures for Airborne Equipment, Rev. G (August 2010). RTCA is an industry alliance that sets rules on key aviation modernization issues.
The new series of modules are available in low profile, low inductance packages with power and signal connectors that designers can solder directly onto printed circuit boards, helping to speed development and improve reliability. Additionally, the modules in this family are of the same height, allowing them to be paralleled or connected into three-phase bridges and other topologies to create higher performance power converters and inverters.
“Microchip’s powerful new modules will help drive innovation in aircraft electrification and ultimately a lower emissions future,” said Leon Gross, vice president of Microchip’s discrete products business unit. Empowering new technology.”
This series of modules utilizes SiC MOSFETs and Schottky Barrier Diodes (SBDs) to maximize system efficiency. Packages in the BL1, BL2, and BL3 series deliver 100W to over 10 KW of power and are available in many topologies, including phase pin, full bridge, asymmetric bridge, boost, buck, and dual common. These high reliability power modules support voltages ranging from 600V to 1200V for SiC MOSFETs and IGBTs, up to 1600V for rectifier diodes.
Microchip’s power module technology and its ISO 9000 and AS9100 certified manufacturing facilities provide high-quality products with flexible manufacturing options.
While introducing new innovations, Micrchip also works with system manufacturers and integrators on burn-in management, helping customers minimize redesign efforts and extend life cycles, thereby reducing total system cost.
Microchip is committed to providing designers with total system solutions for a variety of aerospace and defense applications. Baseless power modules further complement Microchip’s portfolio of motor drive controllers, memory ICs, field programmable gate arrays (FPGAs), microcontrollers (MCUs), memory protection units (MPUs), timing products, semiconductors and point-of-load regulators and other aerospace product portfolio. Microchip also offers complete silicon carbide technology solution products for aerospace, automotive and industrial applications.
Microchip’s BL1, BL2 and BL3 pedestalless power modules have output power specifications including 75A and 145A silicon carbide MOSFETs, as well as 50A IGBTs and 90A rectifier diodes.
For more information, please contact a Microchip sales representative, authorized distributor worldwide or visit the Microchip website. To purchase the products mentioned in this document, please visit the Microchip direct sales website.